STSPIN250 datasheet(7/26 Pages) STMICROELECTRONICS

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DocID029872 Rev 2

7/26

STSPIN250

Electrical data

2.3

Thermal data

2.4

ESD protections

Table 3. Thermal data

Symbol

Parameter

Conditions

Value Unit

RthJA

Junction to ambient thermal resistance Natural convection, according to JESD51-2A(1)

57.1

°C/W

RthJCtop

Junction to case thermal resistance

(top side)

Simulation with cold plate on package top

67.3

°C/W

RthJCbot

Junction to case thermal resistance

(bottom side)

Simulation with cold plate on exposed pad

9.1

°C/W

RthJB

Junction to board thermal resistance

According to JESD51-8(1)

23.3

°C/W

ψJT

Junction to top characterization

According to JESD51-2A(1)

3.3

°C/W

ψJB

Junction to board characterization

According to JESD51-2A(1)

22.6

°C/W

1. Simulated on a 21.2 x 21.2 mm board, 2s2p 1 Oz copper and four 300

m via below exposed pad.

Table 4. ESD protection ratings

Symbol

Parameter

Test condition

Class

Value

Unit

HBM

Human body model

Conforming to ANSI/ESDA/JEDEC JS-001-2014

CDM

Charge device model Conforming to ANSI/ESDA/JEDEC JS-001-2014

C2a

500

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