TN2540 datasheet(3/11 Pages) STMICROELECTRONICS

3 / 11 page

DocID7478 Rev 9

3/11

TN2540, TXN625, TYN625, TYN825, TYN1225

Characteristics

Table 4. Thermal resistances

Symbol

Parameter

Value

Unit

Rth(j-c)

Junction to case (DC)

D2PAK, TO-220AB

1.0

°C/W

TO-220AB ins

2.0

Rth(j-a)

Junction to ambient (DC)

S(1) = 1 cm2

D2PAK

°C/W

TO-220AB, TO-220AB ins

S = Copper surface under tab.

Figure 1. Maximum average power

dissipation versus average

on-state current

Figure 2. Average and DC on-state current

versus case temperature

P(W)

(A)

T(AV)

360°

I(A)

T(AV)

100

125

D2PAK

TO-220AB

TO-220ABins

α = 180°

(°C)

case

Figure 3. Average and DC on-state current

versus ambient temperature

Figure 4. Relative variation of thermal

impedance versus pulse duration (D2PAK, and

TO-220AB)

I(A)

T(AV)

0,0

0,5

1,0

1,5

2,0

2,5

3,0

3,5

100

125

D2PAK

TO-220AB

TO-220ABins

α = 180°

(°C)

amb

1E-3

1E-2

1E-1

1E+0

1E+1

1E+2

5E+2

0.01

0.10

1.00

K=[Z /R

th]

t (s)

Zth(j-c)

Zth(j-a)

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