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TPDV640RG 数据表(PDF) 3 Page - STMicroelectronics |
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TPDV640RG 数据表(HTML) 3 Page - STMicroelectronics |
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3 / 8 page ![]() DocID18270 Rev 2 3/8 TPDVxx40 Characteristics 8 Table 4. Gate characteristics (maximum values) Symbol Parameter Value Unit PG(AV) Average gate power dissipation 1 W PGM Peak gate power dissipation tp = 20 µs 40 W IGM Peak gate current tp = 20 µs 8 A VGM Peak positive gate voltage tp = 20 µs 16 V Table 5. Thermal resistance Symbol Parameter Value Unit Rth(j-a) Junction to ambient 50 °C/W Rth(j-c) DC Junction to case for DC 1.2 °C/W Rth(j-c) AC Junction to case for 360 °conduction angle (F = 50 Hz) 0.9 °C/W Figure 1. Max. rms power dissipation versus on-state rms current (F = 50 Hz) (curves limited by (dI/dt)c) Figure 2. Max. rms power dissipation and max. allowable temperatures (Tamb and Tcase) for various Rth Figure 3. On-state rms current versus case temperature Figure 4. Relative variation of thermal impedance versus pulse duration |
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