SPC560D30X datasheet(33/90 Pages) STMICROELECTRONICS

33 / 90 page

SPC560D30x, SPC56040Dx

Electrical characteristics

Doc ID 16315 Rev 7

33/90

4.6

Thermal characteristics

4.6.1

Package thermal characteristics

4.6.2

Power considerations

The average chip-junction temperature, TJ, in degrees Celsius, may be calculated using

Equation 1:

Table 14.

LQFP thermal characteristics(1)

Symbol C

Parameter

Conditions(2)

Value

Unit

RJA CC D

Thermal resistance, junction-to-ambient natural

convection(3)

Single-layer board —1s

LQFP64

72.1

°C/W

LQFP100

65.2

Four-layer board — 2s2p

LQFP64

57.3

LQFP100

51.8

RJB CC D Thermal resistance, junction-to-board

(4)

Four-layer board — 2s2p

LQFP64

44.1

°C/W

LQFP100

41.3

RJC CC D Thermal resistance, junction-to-case

(5)

Single-layer board — 1s

LQFP64

26.5

°C/W

LQFP100

23.9

Four-layer board — 2s2p

LQFP64

26.2

LQFP100

23.7



CC D

Junction-to-board thermal characterization

parameter, natural convection

Single-layer board — 1s

LQFP64

°C/W

LQFP100

41.6

Four-layer board — 2s2p

LQFP64

LQFP100

43.4



CC D

Junction-to-case thermal characterization

parameter, natural convection

Single-layer board — 1s

LQFP64

11.5

°C/W

LQFP100

10.4

Four-layer board — 2s2p

LQFP64

11.1

LQFP100

10.2

Thermal characteristics are targets based on simulation that are subject to change per device characterization.

VDD = 3.3 V ± 10% / 5.0 V ± 10%, TA = –40 to 125 °C

Junction-to-ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-7. Thermal test board meets

JEDEC specification for this package. When Greek letters are not available, the symbols are typed as RthJA.

Junction-to-board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC specification for

the specified package. When Greek letters are not available, the symbols are typed as RthJB.

Junction-to-case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate temperature is

used for the case temperature. Reported value includes the thermal resistance of the interface layer. When Greek letters

are not available, the symbols are typed as RthJC.

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