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STM8L101x2 数据表(PDF) 77 Page - STMicroelectronics |
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STM8L101x2 数据表(HTML) 77 Page - STMicroelectronics |
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77 / 88 page  DocID15275 Rev 16 77/88 STM8L101x1 STM8L101x2 STM8L101x3 Package information 79 Figure 50. TSSOP20 recommended footprint 1. Dimensions are in millimeters. k0° - 8° 0° - 8° aaa - - 0.100 - - 0.0039 Number of pins 20 1. Values in inches are converted from mm and rounded to 4 decimal digits. 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15mm per side. 3. Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25mm per side. Table 43. TSSOP20 - 20-lead thin shrink small package mechanical data (continued) Dim. mm inches(1) Min Typ Max Min Typ Max |
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