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STM8L151F3 数据表(PDF) 118 Page - STMicroelectronics

部件名 STM8L151F3
功能描述  Reset and supply management
PDF  122 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

STM8L151F3 数据表(HTML) 118 Page - STMicroelectronics

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Package information
STM8L151x2, STM8L151x3
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DocID018780 Rev 9
10.7
Thermal characteristics
The maximum chip junction temperature (TJmax) must never exceed the values given in
Table 17: General operating conditions on page 57.
The maximum chip-junction temperature, TJmax, in degree Celsius, may be calculated using
the following equation:
TJmax = TAmax + (PDmax x ΘJA)
Where:
•
TAmax is the maximum ambient temperature in ° C
•ΘJA is the package junction-to-ambient thermal resistance in ° C/W
•
PDmax is the sum of PINTmax and PI/Omax (PDmax = PINTmax + PI/Omax)
•
PINTmax is the product of IDD and VDD, expressed in Watts. This is the maximum chip
internal power.
•
PI/Omax represents the maximum power dissipation on output pins
Where:
PI/Omax = Σ (VOL*IOL) + Σ((VDD-VOH)*I OH),
taking into account the actual VOL/IOL and VOH/IOH of the I/Os at low and high level in
the application.
Table 62. Thermal characteristics(1)
1. Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection
environment.
Symbol
Parameter
Value
Unit
ΘJA
Thermal resistance junction-ambient
LQFP 48- 7 x 7 mm
65
°C/W
ΘJA
Thermal resistance junction-ambient
UFQFPN 32 - 5 x 5 mm
38
°C/W
ΘJA
Thermal resistance junction-ambient
UFQFPN28 - 4 x 4 mm
80
°C/W
ΘJA
Thermal resistance junction-ambient
UFQFPN20 - 3 x 3 mm
102
°C/W
ΘJA
Thermal resistance junction-ambient
TSSOP20
110
°C/W



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