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STM8S003F3 数据表(PDF) 8 Page - STMicroelectronics |
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STM8S003F3 数据表(HTML) 8 Page - STMicroelectronics |
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8 / 104 page ![]() List of figures STM8S003F3 STM8S003K3 8/104 DocID018576 Rev 9 Figure 48. TSSOP20 – 20-lead thin shrink small outline, 6.5 x 4.4 mm, 0.65 mm pitch, package footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92 Figure 49. TSSOP20 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 Figure 50. UFQFPN20 - 20-lead, 3 x 3 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 Figure 51. UFQFPN20 - 20-lead, 3 x 3 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 Figure 52. UFQFPN20 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 Figure 53. STM8S003F3/K3 value line ordering information scheme(1) . . . . . . . . . . . . . . . . . . . . . . . 99 |
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