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STM32F072VB 数据表(PDF) 107 Page - STMicroelectronics |
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STM32F072VB 数据表(HTML) 107 Page - STMicroelectronics |
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107 / 128 page  DocID025004 Rev 5 107/128 STM32F072x8 STM32F072xB Package information 124 Figure 42. Recommended footprint for UFBGA64 package ddd - - 0.080 - - 0.0031 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 75. UFBGA64 recommended PCB design rules Dimension Recommended values Pitch 0.5 Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.100 mm Table 74. UFBGA64 package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.460 0.530 0.600 0.0181 0.0209 0.0236 |
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