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STM32F302XD 数据表(PDF) 13 Page - STMicroelectronics |
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STM32F302XD 数据表(HTML) 13 Page - STMicroelectronics |
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13 / 168 page ![]() DocID026900 Rev 4 13/168 STM32F302xD STM32F302xE Description 63 Table 2. STM32F302xD/E family device features and peripheral counts Peripheral STM32F302Rx STM32F302Vx STM32F302Zx Flash (Kbytes) 384 512 384 512 384 512 SRAM (Kbytes) on data bus 64 FMC ( flexible memory controller) NO YES Timers Advanced control 1 (16-bit) General purpose 5 (16-bit) 1 (32-bit) Basic 1 (16-bit) PWM channels (all) (1) 26 PWM channels (except complementary) 20 Communication interfaces SPI (I2S)(2) 4(2) I2C3 USART 3 UART 2 CAN 1 USB 1 GPIOs Normal I/Os (TC, TTa) 26 37 in WLCSP100,44 in LQFP100 and UFBGA100 45 5-volt tolerant I/Os (FT, FTf) 25 42 in LQFP100 40 in WLCSP100 and UFBGA100 70 DMA channels 12 Capacitive sensing channels 18 24 12-bit ADCs 2 16 channels 2 17 channels 2 18 channels 12-bit DAC channels 1 Analog comparator 4 Operational amplifiers 2 CPU frequency 72 MHz Operating voltage 2.0 to 3.6 V Operating temperature Ambient operating temperature: - 40 to 85 °C / - 40 to 105 °C Junction temperature: - 40 to 125 °C Packages LQFP64 LQFP100 ,WLCSP100 UFBGA100 LQFP144 1. This total number considers also the PWMs generated on the complementary output channels. 2. The SPI interfaces works in an exclusive way in either the SPI mode or the I2S audio mode. |
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