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STM32L100RB 数据表(PDF) 85 Page - STMicroelectronics |
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STM32L100RB 数据表(HTML) 85 Page - STMicroelectronics |
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85 / 103 page ![]() DocID024295 Rev 5 85/103 STM32L100C6 STM32L100R8/RB Electrical characteristics 90 Figure 24. Maximum dynamic current consumption on VDDA supply pin during ADC conversion General PCB design guidelines Power supply decoupling should be performed as shown in Figure 8, depending on whether VREF+ is connected to VDDA or not. The 100 nF capacitors should be ceramic (good quality). They should be placed as close as possible to the chip. ADC clock Sampling (n cycles) Conversion (12 cycles) IDDA 1300 µA 1700 µA MS36686V1 Table 55. Maximum source impedance RAIN max(1) Ts (µs) RAIN max (kOhm) Ts (cycles) fADC= 16 MHz(2) Multiplexed channels Direct channels 2.4 V < VDDA< 3.6 V 1.8 V < VDDA < 2.4 V 2.4 V < VDDA< 3.3 V 1.8 V < VDDA < 2.4 V 0.25 Not allowed Not allowed 0.7 Not allowed 4 0.5625 0.8 Not allowed 2.0 1.0 9 1 2.0 0.8 4.0 3.0 16 1.5 3.0 1.8 6.0 4.5 24 3 6.8 4.0 15.0 10.0 48 6 15.0 10.0 30.0 20.0 96 12 32.0 25.0 50.0 40.0 192 24 50.0 50.0 50.0 50.0 384 1. Guaranteed by design. 2. Number of samples calculated for fADC = 16 MHz. For fADC = 8 and 4 MHz the number of sampling cycles can be reduced with respect to the minimum sampling time Ts (us). |
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