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STM32L443CC 数据表(PDF) 151 Page - STMicroelectronics |
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STM32L443CC 数据表(HTML) 151 Page - STMicroelectronics |
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151 / 207 page  DocID028739 Rev 2 151/207 STM32L443CC STM32L443RC STM32L443VC Electrical characteristics 177 Figure 29. ADC accuracy characteristics Figure 30. Typical connection diagram using the ADC 1. Refer to Table 63: ADC characteristics for the values of RAIN, RADC and CADC. 2. Cparasitic represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the pad capacitance (refer to Table 58: I/O static characteristics for the value of the pad capacitance). A high Cparasitic value will downgrade conversion accuracy. To remedy this, fADC should be reduced. 3. Refer to Table 58: I/O static characteristics for the values of Ilkg. General PCB design guidelines Power supply decoupling should be performed as shown in Figure 16: Power supply scheme. The 10 nF capacitor should be ceramic (good quality) and it should be placed as close as possible to the chip. |
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