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TPS62290DRVR 数据表(PDF) 4 Page - Texas Instruments |
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TPS62290DRVR 数据表(HTML) 4 Page - Texas Instruments |
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4 / 27 page ![]() TPS62290, TPS62291, TPS62293 SLVS764F – JUNE 2007 – REVISED JANUARY 2016 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings Over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VIN Input voltage range (2) –0.3 7 Voltage range at EN, MODE –0.3 VIN +0.3, ≤ 7 V Voltage at SW –0.3 7 Peak output current Internally limited A TJ Maximum operating junction temperature –40 125 °C Tstg Storage temperature –65 150 (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground terminal. 7.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions MIN NOM MAX UNIT VIN Supply voltage 2.3 6 V Output voltage range for adjustable voltage 0.6 VIN V TA Operating ambient temperature –40 85 °C TJ Operating junction temperature –40 125 °C 7.4 Thermal Information TPS6229x THERMAL METRIC(1) DRV (SON) UNIT 6 PINS RθJA Junction-to-ambient thermal resistance 67.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 88.6 °C/W RθJB Junction-to-board thermal resistance 37.2 °C/W ψJT Junction-to-top characterization parameter 2 °C/W ψJB Junction-to-board characterization parameter 37.6 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 7.9 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: TPS62290 TPS62291 TPS62293 |
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