M95M01-DF datasheet(49/51 Pages) STMICROELECTRONICS

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M95M01-DF M95M01-R

Revision history

20-Jun-2012

Datasheet split into:

– M95M01-125 datasheet for automotive products (range 3),

– M95M01-DF, M95M01-R (this datasheet) for standard products (range

6).

Updated:

– WLCSP package dimensions: Figure 44: M95080-DFCS6TP/K,

WLCSP 8-bump wafer-level chip scale package outline and Table 60:

M95080-DFCS6TP/K, WLCSP 8-bump wafer-level chip scale package

mechanical data

– Cycling and data retention performances (4 million Write cycles, 200-

year data retention)

– Table 14: DC characteristics updated with 1.7 V values

– Table 15: AC characteristics updated with 16 MHz clock

Added:

– Identification page (M95M01-DF)

– 1.7 V/5.5 V device (reference M95M01-DF)

Deleted:

– Reference M95M01-W3

06-Jul-2012

Updated WLCSP package reference from “CT” to “CS”.

3-Sep-2012

Fixed some errors in Figure 3: WLCSP connections for M95M01-

DFCS6TP/K (top view, marking side, with bumps on the underside)

25-May-2015

Replaced “ball” by “bump” in the entire document.

Updated Features and WLCSP package figure on cover page.

Removed Caution note on UV exposure in Section 1: Description.

Updated Figure 3: WLCSP connections for M95M01-DFCS6TP/K (top

view, marking side, with bumps on the underside), Figure 4: Block

diagram and Figure 14: Page Write (WRITE) sequence.

Updated Section 5.1.3: Power-up conditions, Section 5.3: Hold condition,

Section 6: Instructions. and Section 7.2: Initial delivery state.

Updated Table 7: Absolute maximum ratings and its footnotes.

Updated Section 10: Package information with changes in each of

Sections 10.1: SO8N package information, 10.2: TSSOP8 package

information and 10.8: WLCSP package information.

Updated Table 31: Ordering information scheme and added Note: on

Engineering samples.

Updated Disclaimer.

Table 22. Document revision history (continued)

Date

Revision

Changes

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