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AS6C1608 数据表(PDF) 9 Page - Alliance Semiconductor Corporation |
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AS6C1608 数据表(HTML) 9 Page - Alliance Semiconductor Corporation |
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9 / 13 page ![]() AS6C1608 Rev. 1.1 2048K X 8 BIT LOW POWER CMOS SRAM Alliance Memory Inc.reserves the rights to change the specifications and products without notice. Alliance Memory, Inc. 551 Taylor Way, Suite #1, San Carlos, CA 94070, USA Tel: +1 650 610 6800 Fax: +1 650 620 9211 8 DATA RETENTION CHARACTERISTICS PARAMETER SYMBOL TEST CONDITION MIN. TYP. MAX. UNIT VCC for Data Retention VDR CE# ≧ VCC - 0.2V or CE2≦0.2V 1.2 - 3.6 V Data Retention Current IDR VCC = 1.2V CE# ≧VCC-0.2V or CE2≦0.2V Other pins at 0.2V or VCC-0.2V SL SLI 25℃ - 2.5 10 µA 40℃ - 2.5 10 µA SL - 2.5 30 µA SLI - 2.5 40 µA Chip Disable to Data Retention Time tCDR See Data Retention Waveforms (below) 0 - - ns Recovery Time tR tRC* - - ns tRC* = Read Cycle Time DATA RETENTION WAVEFORM Low Vcc Data Retention Waveform (1) (CE# controlled) Vcc CE# VDR ¡Ù 1.2V CE# ¡Ù Vcc-0.2V Vcc(min.) VIH tR tCDR VIH Vcc(min.) Low Vcc Data Retention Waveform (2) (CE2 controlled) Vcc CE2 VDR ¡Ù 1.2V CE2 ¡Ø 0.2V Vcc(min.) VIL tR tCDR VIL Vcc(min.) |
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