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FDA801 数据表(PDF) 9 Page - STMicroelectronics |
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FDA801 数据表(HTML) 9 Page - STMicroelectronics |
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9 / 11 page ![]() DocID028631 Rev 1 9/11 FDA801 Package information 11 Table 3. LQFP64 (10x10x1.4 mm exp. pad up) package mechanical data Ref Dimensions Millimeters Inches(1) 1. Values in inches are converted from mm and rounded to 4 decimal digits. Min. Typ. Max. Min. Typ. Max. Ө 0° 3.5° 6° 0° 3.5° 6° Ө1 0° 9° 12° 0° 9° 12° Ө2 11° 12° 13° 11° 12° 13° Ө3 11° 12° 13° 11° 12° 13° A - - 1.49 - - 0.0587 A1 -0.04 - 0.04 -0.0016 - 0.0016 A2 1.35 1.4 1.45 0.0531 0.0551 0.0571 b - - 0.255 - - 0.0100 b1 0.17 0.20 0.23 0.0067 0.0079 0.0091 c 0.09 - 0.20 0.0035 - 0.0079 c1 0.09 - 0.16 0.0035 - 0.0063 D - 12.00 - - 0.4724 - D1(2) 2. Dimensions D1 and E1 do not include mold flash or protrusions. Allowable mold flash or protrusion is “0.25 mm” per side. - 10.00 - - 0.3937 - D2(3) 3. The optional exposed pad is generally coincident with the top or bottom side of the package and not allowed to protrude beyond that surface. - 6.00 - - 02362 - e - 0.50 - - 0.0197 - E - 12.00 - - 0.4724 - E1(2) - 10.00 - - 0.3937 - E2(3) - 6.00 - - 0.2362 - L 0.45 0.60 0.75 0.0177 0.0236 0.0295 L1 - 1.00 - - 0.0394 - N - 64.00 - - 2.5197 - R1 0.08 - - 0.0031 - - R2 0.08 - 0.20 0.0031 - 0.0079 S 0.20 - - 0.0079 - - aaa - 0.20 - - 0.0079 - bbb - 0.20 - - 0.0079 - ccc - 0.08 - - 0.0031 - ddd - 0.08 - - 0.0031 - |
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