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MMDFS3P303R2 数据表(PDF) 2 Page - ON Semiconductor

部件名 MMDFS3P303R2
功能描述  Power MOSFET 3 Amps, 30 Volts
PDF  12 Pages
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制造商  ONSEMI [ON Semiconductor]
网页  http://www.onsemi.com
标志 ONSEMI - ON Semiconductor

MMDFS3P303R2 数据表(HTML) 2 Page - ON Semiconductor

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MMDFS3P303
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SCHOTTKY RECTIFIER MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Peak Repetitive Reverse Voltage
DC Blocking Voltage
VRRM
VR
30
Volts
Average Forward Current (Note 3.)
(Rated VR) TA = 100°C
IO
3.0
Amps
Peak Repetitive Forward Current (Note 3.)
(Rated VR, Square Wave, 20 kHz) TA = 105°C
Ifrm
6.0
Amps
Non–Repetitive Peak Surge Current
(Surge applied at rated load conditions, halfwave, single phase, 60 Hz)
Ifsm
30
Amps
THERMAL CHARACTERISTICS – SCHOTTKY AND MOSFET
Thermal Resistance – Junction–to–Ambient (Note 4.) – MOSFET
RqJA
201
°C/W
Thermal Resistance – Junction–to–Ambient (Note 5.) – MOSFET
RqJA
105
Thermal Resistance – Junction–to–Ambient (Note 3.) – MOSFET
RqJA
62.5
Thermal Resistance – Junction–to–Ambient (Note 4.) – Schottky
RqJA
197
Thermal Resistance – Junction–to–Ambient (Note 5.) – Schottky
RqJA
97
Thermal Resistance – Junction–to–Ambient (Note 3.) – Schottky
RqJA
62.5
Operating and Storage Temperature Range
Tj, Tstg
–55 to 150
°C
3. Mounted on 2
″ square FR4 board (1″ sq. 2 oz. Cu 0.06″ thick single sided), 10 sec. max.
4. Mounted with minimum recommended pad size, PC Board FR4.
5. Mounted on 2
″ square FR4 board (1″ sq. 2 oz. Cu 0.06″ thick single sided), Steady State.
MOSFET ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted) (Notes 1. & 6.)
Characteristics
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Drain–Source Voltage
(VGS = 0 Vdc, ID = 0.25 mA)
Temperature Coefficient (Positive)
V(BR)DSS
30
27
Vdc
mV/
°C
Zero Gate Drain Current
(VDS = 30 Vdc, VGS = 0 Vdc)
(VDS = 30 Vdc, VGS = 0 Vdc, TJ = 125°C)
IDSS
1.0
10
µAdc
Gate Body Leakage Current
(VGS = ± 20 Vdc, VDS = 0)
IGSS
100
nAdc
ON CHARACTERISTICS (Note 6.)
Gate Threshold Voltage
(VDS = VGS, ID = 0.25 mA)
Temperature Coefficient (Negative)
VGS(th)
1.0
1.7
3.5
Vdc
mV/
°C
Static Drain–Source Resistance (VGS = 10 Vdc, ID = 3.5 Adc)
(VGS = 4.5 Vdc, ID = 2.0 Adc)
RDS(on)
0.085
0.130
0.100
0.160
W
Forward Transconductance (VDS = 15 Vdc, ID = 3.5 Adc)
gFS
5.0
mhos
DYNAMIC CHARACTERISTICS
Input Capacitance
(V
25 Vd
V
0 Vd
Ciss
405
pF
Output Capacitance
(VDS = 25 Vdc, VGS = 0 Vdc,
f = 1.0 MHz)
Coss
200
Reverse Transfer Capacitance
f = 1.0 MHz)
Crss
55
SWITCHING CHARACTERISTICS (Note 7.)
Turn–On Delay Time
td(on)
12.5
25
ns
Rise Time
(VDD = 20 Vdc, ID = 2.0 Adc,
VGS =10Vdc
tr
16
30
Turn–Off Delay Time
VGS = 10 Vdc,
RG = 6.0 Ω)
td(off)
50
90
Fall Time
RG 6.0 Ω)
tf
35
65
1. Negative signs for P–Channel device omitted for clarity.
6. Pulse Test: Pulse Width
≤ 300 µs, Duty Cycle ≤ 2%.
7. Switching characteristics are independent of operating junction temperature.



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