STOD03AS datasheet(16/25 Pages) STMICROELECTRONICS

部件名	STOD03AS

功能描述	Dual DC-DC converter for powering AMOLED displays

PDF	25 Pages

Scroll/Zoom	100%

制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

标志

16 / 25 page

Application information

STOD03AS

16/25

DocID022614 Rev 2

7.2

Recommended PCB layout

The STOD03AS is high frequency power switching device and therefore requires a proper

PCB layout in order to obtain the necessary stability and optimize line/load regulation and

output voltage ripple.

Analog input (VINA) and power input (VINP) must be kept separated and connected together

at the CIN pad only. The input capacitor must be as close as possible to the IC.

In order to minimize the ground noise, a common ground node for power ground and a

different one for analog ground must be used. In the recommended layout, the AGND node

is placed close to CREF ground while the PGND node is centered at CIN ground. They are

connected by a separated layer routing on the bottom through vias.

The exposed pad is connected to AGND through vias.

Figure 14. Top layer and silk-screen (top view, not to scale)

STOD03AS 数据表(PDF) 16 Page - STMicroelectronics