STOD13CM datasheet(14/25 Pages) STMICROELECTRONICS

14 / 25 page

Application information

STOD13CM

14/25

024087 Rev 1

6.2

Recommended PCB layout

The STOD13CM is a high frequency power switching device and therefore requires a proper

PCB layout in order to obtain the necessary stability and optimize line/load regulation and

output voltage ripple.

Analog input (VINA) and power input (VINP) must be kept separated and connected at the

CIN pad only. The input capacitor must be as close as possible to the IC.

In order to minimize ground noise, a common ground node for power ground and a different

one for analog ground must be used. In the recommended layout, the AGND node is placed

close to CREF ground while the PGND node is centered at CIN ground. They are connected

by a separated layer routing on the bottom through vias.

The exposed pad is connected to AGND through vias.

In order to provide precise VMID sensing, proper PCB layout is mandatory.

Figure 11.

Top layer and silk-screen (top view, not to scale)

Figure 12.

Bottom layer and silk-screen (top view, not to scale)

STOD13CM 数据表(PDF) 14 Page - STMicroelectronics