Package information

ECMF02-3F3

10/12

DocID023283 Rev 3

Figure 15. Footprint recommendations

Figure 16. Flip Chip tape and reel specification

Note:

More information is available in the application notes:

AN2348, “IPAD™ 400 µm Flip Chip: package description and recommendations for use”

AN1751, “EMI filters: recommendations and measurements”

220 µm recommended

220 µm recommended

260 µm maximum

Solder stencil opening:

Copper pad Diameter:

Solder mask opening:

300 µm minimum

Dot identifying Pin A1 location

User direction of unreeling

All dimensions are in mm

4.0 ± 0.1

4.0 ± 0.1

2.0 ± 0.05

Ø 1.50 ± 0.1

0.59 ± 0.05

0.93 ± 0.05

0.20 ± 0.02