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ECMF02-3HSM6 数据表(PDF) 12 Page - STMicroelectronics |
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ECMF02-3HSM6 数据表(HTML) 12 Page - STMicroelectronics |
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12 / 15 page ![]() Package information ECMF02-3HSM6 12/15 DocID024843 Rev 3 Note: Product marking may be rotated by multiples of 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. Table 3. µQFN-6L package mechanical data Ref. Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.45 0.50 0.55 0.018 0.020 0.022 A1 0.00 0.02 0.05 0.00 0.0008 0.002 b 0.15 0.20 0.25 0.006 0.008 0.010 D 1.55 1.60 1.65 0.061 0.063 0.065 E 1.30 1.35 1.40 0.051 0.053 0.055 e 0.45 0.50 0.55 0.018 0.020 0.022 L 0.40 0.50 0.60 0.016 0.020 0.024 Figure 22. Footprint Figure 23. Marking 0.20 0.50 0. 0 7 1.75 1.20 KM |
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