EMIF03-SIM05F3

Package information

Doc ID 023284 Rev 1

7/9

3

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

specifications, grade definitions and product status are available at: www.st.com.

Figure 19.

WLCSP package dimensions

Figure 20.

Footprint recommendations

Figure 21.

Marking

3

2

1

A

B

C

1.22 mm ± 0.05 µm

255 ± 40 µm

∅

220 µm recommended

220 µm recommended

260 µm maximum

Solder stencil opening:

Copper pad Diameter:

Solder mask opening:

300 µm minimum

x

y

x

w

z

w

Dot, ST logo

xx = marking

z = manufacturing location

yww = datecode

(y = year

ww = week)

ECOPACK® grade