2001 Nov 21

21

Philips Semiconductors

Product specification

Dual-band power amplifier controller for

GSM, PCN and DCS

PCF5079

13 PACKAGE OUTLINES

UNIT

A1

A

max.

A2

A3

bp

L

HE

Lp

wy

v

ce

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

mm

0.15

0.05

0.95

0.80

0.30

0.15

0.23

0.15

3.10

2.90

3.10

2.90

0.50

5.00

4.80

0.67

0.34

6

°

0

°

0.1

0.1

0.1

0.95

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

0.70

0.40

SOT552-1

99-07-29

bp

D

Z

e

0.25

15

10

6

θ

A

A2

A1

Lp

(A3)

detail X

L

HE

E

c

X

A

y

2.5

5 mm

0

scale

TSSOP10: plastic thin shrink small outline package; 10 leads; body width 3 mm

SOT552-1

1.10

pin 1 index