SMTYF datasheet(5/8 Pages) STMICROELECTRONICS

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SMTYF

Characteristics

5/8

Figure 7.

Average power dissipation versus

ambient temperature

Figure 8.

Relative variation of thermal

impedance junction to ambient

versus pulse duration (printed

ciruit board FR4, SCu = 1 cm

Figure 9.

Thermal resistance junction to

ambient versus copper surface

under each lead

(printed circuit board FR4,

copper thickness = 35 µm)

Figure 10.

Leakage current versus junction

temperature (typical values)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

100

125

150

175

P(W)

th(j-a)=Rth(j-l)

th(j-a)=200 °C/W

(PCB FR4, recommended pad layout)

Tamb(°C)

Zth(j-a)/Rth(j-a)

0.00

0.01

0.10

1.00

1.0E-03

1.0E-02

1.0E-01

1.0E+00

1.0E+01

1.0E+02

1.0E+03

On recommended pad

layout

t (S)

Rth(j-a)(°C/W)

100

120

140

160

180

200

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0

(cm )

I (µA)

1.E+00

1.E+01

1.E+02

1.E+03

1.E+04

1.E+05

100

125

150

175

R=VRM

SMTYF5.0A

SMTYF12A

T (°C)

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