TPI

Package information

7/9

4

Package information

●

Epoxy meets UL94, V0

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Figure 11.

SO-8 footprint, dimensions in mm (inches)

Table 5.

SO-8 dimensions

Ref.

Dimensions

Millimeters

Inches

Min. Typ. Max. Min.

Typ. Max.

A

1.75

0.069

A1

0.1

0.25 0.004

0.010

A2 1.25

0.049

b

0.28

0.48 0.011

0.019

C

0.17

0.23 0.007

0.009

D

4.80 4.90 5.00 0.189 0.193 0.197

E

5.80 6.00 6.20 0.228 0.236 0.244

E1 3.80 3.90 4.00 0.150 0.154 0.157

e

1.27

0.050

h

0.25

0.50 0.010

0.020

L

0.40

1.27 0.016

0.050

L1

1.04

0.041

k0°

8°

0°

8°

ppp

0.10

0.004

E1

D

8

4

1

5

E

e

A

A2

b

A1

ppp C

C

k

h x 45°

L

L1

Seating

Plane

C

6.8

(0.268)

4.2

(0.165)

1.27

(0.050)

0.6

(0.024)