Package information

TS2012EI

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DocID026152 Rev 1

5

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

specifications, grade definitions and product status are available at: www.st.com.

Figure 41. Flip Chip 16 package mechanical drawing

Die size: 2.07 x 2.07 mm ± 50 µm

Die height (including bumps):

600 µm

Bump diameter: 315 µm ±50µm

Bump diameter before reflow:

300 µm ±10µm

Bump height: 250 µm ±40 µm

Die height: 350 µm ±20µm

Pitch: 500 µm ±50 µm

Bump Coplanarity: 60 µm max

Optional*: back coating height:

40 µm

500

m

2.1 mm

2.1 mm

600

m

40

m*

G1

INL+

250

m

500

m

2.1 mm

2.1 mm

600

m

40

m*

G1

INL+

250

m

2.07mm

2.07 mm