TUSB8043 datasheet(52/59 Pages) TI1

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PACKAGE OUTLINE

SEE DETAIL

64X

0.30

0.18

6 0.05

64X

0.5

0.3

1 MAX

(0.2) TYP

0.05

0.00

60X 0.5

7.5

2X 7.5

9.1

8.9

9.1

8.9

(0.1) TYP

VQFN - 1 mm max height

RGC0064G

PLASTIC QUAD FLATPACK - NO LEAD

4222053/B 06/2015

PIN 1 INDEX AREA

0.08

SEATING PLANE

(OPTIONAL)

PIN 1 ID

0.1

C A

0.05

EXPOSED

THERMAL PAD

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

SCALE 1.500

SCALE 8.000

LEADFRAME PROFILE

OPTION

TUSB8043

SLLSEW4 – JUNE 2017

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Product Folder Links: TUSB8043

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TUSB8043 数据表(PDF) 52 Page - Texas Instruments

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