SPE-14-8-103/A/MC

Page 25 of 25

10.

Recommended Reflow Temperature Profile

PA.25 and ASGP.1575.25B.4.A.01 can be assembled following either Sn-Pb or Pb-Free assembly

processes. The recommended soldering temperatures are as follows:

Taoglas makes no warranties based on the accuracy or completeness of the contents of this document and reserves the right to make changes to

specifications and product descriptions at any time without notice. Taoglas reserves all rights to this document and the information contained herein.

Reproduction, use or disclosure to third parties without express permission is strictly prohibited. Copyright © 2014, Taoglas Ltd.