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TIP32CM 数据表(PDF) 1 Page - First Components International |
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TIP32CM 数据表(HTML) 1 Page - First Components International |
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1 / 1 page ![]() General Description: Silicon epitaxial chip of p-n-p medium power transistor (Ic max=3A) used for general-purpose amplifier and switching application. Complementary pair TIP31C Recommended ultrasonic bonding wire Al Emitter - 2 wire dia 80 µm Base - 1 wire dia 80 µm ELECTRICAL CHARACTERISTICS CHIPS ON WAFER (Ta=25 °C) Parameter Symbol Unit Measurement Mode Min Max Collector cutoff Current Iceo mA Vce=45V; Ib=0 0.3 Collector cutoff Current Ices mA Vce=60V; Ube=0 0.2 Emitter cutoff Current Iebo mA Veb=5,0 V; Ic=0 1.0 Collector – Emitter Sustaining Vceo (sus) V Ic=30 mA, Ib=0 60 DC Current Gain(1) ** hFE Vce=4V; Ic=1A 100 Small-Signal Current Gain ** hfe Vce=10V; Ic=0,5 A f=1kHz 20 Collector-Emitter Saturation Voltage(1) Vce(sat) V Ic=1A; Ib=35mA 0.5 Base- Emitter On Voltage(1) ** Vbe(on) V Vce=4 V; Ic=3 A 1.8 1.Pulse Tests: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2% 2.** In a circuit with common base Ucb= Uce-1v ; Ie=Ic Wafer Diameter -- 100 mm Wafer thickness -- 270 ± 20 µm; Die size -- 1.7 x 1.7 mm ; Metallization: Top -- Al 4.5 ± 0.5 µm Bottom -- Ti-Ni-Ag Ti = 0.1 ± 0.02 µm Ni = 0.5 ± 0.1 µm Ag = 0.6 ± 0.1 µm Bondpad size: 1. Base 0.4 x 0.3 mm 2.Emitter 0.312 x 0.312 mm |
类似零件编号 - TIP32CM |
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类似说明 - TIP32CM |
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