MPC7457EC datasheet(13/68 Pages) FREESCALE

13 / 68 page

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 5

Freescale Semiconductor

Electrical and Thermal Characteristics

Table 5 provides the package thermal characteristics for the MPC7457.

Table 6 provides the DC electrical characteristics for the MPC7457.

Table 5. Package Thermal Characteristics 1

Characteristic

Symbol

Value

Unit

Notes

MPC7447

MPC7457

Junction-to-ambient thermal resistance, natural convection

RθJA

°C/W

2, 3

Junction-to-ambient thermal resistance, natural convection,

four-layer (2s2p) board

RθJMA

°C/W

2, 4

Junction-to-ambient thermal resistance, 200 ft/min airflow,

single-layer (1s) board

RθJMA

°C/W

2, 4

Junction-to-ambient thermal resistance, 200 ft/min airflow,

four-layer (2s2p) board

RθJMA

°C/W

2, 4

Junction-to-board thermal resistance

RθJB

°C/W

Junction-to-case thermal resistance

RθJC

<0.1

°C/W

Coefficient of thermal expansion

6.8

ppm/°C

Notes:

1. Refer to Section 9.8, “Thermal Management Information,” for more details about thermal management.

2. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal

resistance.

3. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.

4. Per JEDEC JESD51-6 with the board horizontal.

5. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured

on the top surface of the board near the package.

6. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method

1012.1) with the calculated case temperature. The actual value of RθJC for the part is less than 0.1°C/W.

Table 6. DC Electrical Specifications

At recommended operating conditions. See Table 4.

Characteristic

Nominal

Bus

Voltage 1

Symbol

Min

Max

Unit

Notes

Input high voltage

(all inputs including SYSCLK)

1.5

VIH

GVDD × 0.65

GVDD + 0.3

1.8

OVDD/GVDD × 0.65

OVDD/GVDD + 0.3

2.5

1.7

OVDD/GVDD + 0.3

Input low voltage

(all inputs including SYSCLK)

1.5

VIL

–0.3

GVDD × 0.35

2, 6

1.8

–0.3

OVDD/GVDD × 0.35

2.5

–0.3

0.7

Input leakage current, Vin = GVDD/OVDD

—

Iin

—

µA

2, 3

High-impedance (off-state) leakage

current, Vin = GVDD/OVDD

—

ITSI

—

µA

2, 3, 4

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