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ASL30G 数据表(PDF) 2 Page - Advanced Semiconductor Business Inc. |
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ASL30G 数据表(HTML) 2 Page - Advanced Semiconductor Business Inc. |
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2 / 22 page ![]() 2/22 ASB Inc. sales@asb.co.kr Tel: +82-42-528-7225 February 2017 ASL30G DC ~ 6000 MHz MMIC LNA Note: 1. The number and size of ground via holes in a circuit board is critical for thermal and RF grounding considerations. 2. We recommend that the ground via holes be placed on the bottom of lead pin 2, 4 and 5 for better RF and thermal performance, as shown in the drawing at the left side. 3. You can download the gerber file of ASL226 from http://www.asb.co.kr/s-para/ASL226_gerber.zip Pin No. Function Pin No. Function. 1 VDD 4 GND 2 GND 5 GND 3 RF OUT 6 RF IN Outline Drawing ㅎ ㅎ ㅎ Part No. Mounting Recommendation (In mm) Symbols Dimensions (In mm) Dimensions (In inch) MIN MAX MIN MAX A 0.90 1.10 .036 .044 A1 0.025 0.10 .001 .004 A2 0.875 1.00 .035 .040 b 0.20 0.40 .008 .016 C 0.10 0.15 .004 .006 D 1.90 2.10 .076 .084 F 1.15 1.35 .046 .054 E1 2.00 2.20 .080 .088 e 0.65 BSC. .026 BSC. e1 1.30 BSC. .052 BSC. L 0.425 REF. .017 REF.. ESD Classification (Test Method : AEC-Q100) HBM Class H0 (Voltage Level: 200 V) MM Class M0 (Voltage Level: 50 V) CDM Class C4 (Voltage Level: 800 V) CAUTION: ESD-sensitive device! Moisture Sensitivity Level Level 3 at 260 C reflow ESD Classification & Moisture Sensitivity Level |
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