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ASF140 数据表(PDF) 8 Page - Advanced Semiconductor Business Inc. |
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ASF140 数据表(HTML) 8 Page - Advanced Semiconductor Business Inc. |
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8 / 9 page ![]() 8/9 ASB Inc. sales@asb.co.kr February 2017 ASF140 4. Package Outline (SOT343, 2.15x2.0x1.0 mm) 5. Surface Mount Recommendation (In mm) 0.42 1.48 1.23 0.30 0.50 0.30 0.30 Symbols Dimensions (In mm) MIN MAX A 0.90 1.10 A1 0.025 0.10 A2 0.875 1.00 b 0.20 0.40 b1 0.50 0.70 C 0.10 0.15 D 1.90 2.10 E 1.15 1.35 E1 2.00 2.30 e 0.65BSC e1 1.30BSC e2 0.15BSC L 0.425REF L1 0.300REF L2 0.200REF NOTE 1. The number and size of ground via holes in a circuit board are critical for thermal and RF grounding considerations. 2. Recommend is that the ground via holes be placed on the bottom of the ground leads and exposed pad of the device for better RF and thermal performance, as shown in the drawing at the left side. |
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