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MPXM2010GS 数据表(PDF) 187 Page - Motorola, Inc |
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MPXM2010GS 数据表(HTML) 187 Page - Motorola, Inc |
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187 / 670 page  MPX2102 MPXV2102G SERIES 3–41 Motorola Sensor Device Data www.motorola.com/semiconductors LINEARITY Linearity refers to how well a transducer’s output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure 2) or (2) a least squares best line fit. While a least squares fit gives the “best case” linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the “worst case” error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Motorola’s specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. Figure 2. Linearity Specification Comparison LEAST SQUARE DEVIATION PRESSURE (% FULLSCALE) 0 50 100 END POINT STRAIGHT LINE FIT EXAGGERATED PERFORMANCE CURVE LEAST SQUARES FIT STRAIGHT LINE DEVIATION OFFSET ON–CHIP TEMPERATURE COMPENSATION and CALIBRATION Figure 3 shows the output characteristics of the MPX2102/MPXV2102G series at 25 °C. The output is directly proportional to the differential pressure and is essentially a straight line. The effects of temperature on Full Scale Span and Offset are very small and are shown under Operating Characteris- tics. Figure 3. Output versus Pressure Differential Figure 4. Cross–Sectional Diagrams (Not to Scale) kPa PSI 40 35 30 25 15 10 5 0 –5 025 3.62 50 7.25 75 10.87 100 14.5 SPAN RANGE (TYP) OFFSET (TYP) 20 TYP MIN VS = 10 Vdc TA = 25°C P1 > P2 MAX SILICONE GEL DIE COAT WIRE BOND LEAD FRAME DIFFERENTIAL/GAUGE DIE STAINLESS STEEL METAL COVER EPOXY CASE DIFFERENTIAL/GAUGE ELEMENT DIE BOND SILICONE GEL DIE COAT WIRE BOND LEAD FRAME ABSOLUTE DIE STAINLESS STEEL METAL COVER EPOXY CASE DIE BOND ABSOLUTE ELEMENT P1 P2 P1 P2 Figure 4 illustrates the absolute sensing configuration (right) and the differential or gauge configuration in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX2102/MPXV2102G series pressure sensor oper- ating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Me- dia other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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