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MB08M 数据表(PDF) 1 Page - SeCoS Halbleitertechnologie GmbH

部件名 MB08M
功能描述  1000V 0.8 Amp Miniature SMD Glass Passivated Bridge Rectifiers
PDF  2 Pages
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制造商  SECOS [SeCoS Halbleitertechnologie GmbH]
网页  http://www.secosgmbh.com
标志 SECOS - SeCoS Halbleitertechnologie GmbH

MB08M 数据表(HTML) 1 Page - SeCoS Halbleitertechnologie GmbH

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Elektronische Bauelemente
MB08M
1000V 0.8 Amp
Miniature SMD Glass Passivated Bridge Rectifiers
27-Sep-2013 Rev. A
Page 1 of 2
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
RoHS compliant product
A suffix of “-C” specifies halogen & lead-free
FEATURES
Halogen-free type
Glass passivated chip junctions
Compliance to RoHS product
Leadless chip form, no lead damage
Low power loss, High efficiency
High current capability
Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
APPLICATION
AC/DC Power Supply
Communication Equipment
Lighting
MECHANICAL DATA
Case : Packed with FRP substrate and epoxy underfilled
Terminals : Pure Tin plated (Lead-Free),
solderable per MIL-STD-750, Method 2026
MARKING
PACKAGE INFORMATION
Package
MPQ
Leader Size
MBCN
5K
13 inch
ABSOLUTE MAXIMUM RATINGS ( T
A=25℃unless otherwise specified)
Parameters
Symbol
Rating
Unit
Repetitive peak reverse voltage
VRRM
1000
V
on glass-epoxy P.C.B.
1
0.5
Average Forward Current
on aluminum substrate
2
IF(AV)
0.8
A
Peak forward surge current, 8.3ms single half sine-wave
IFSM
30
A
Operating and Storage temperature range
TJ, TSTG
-55 ~ 150
ELECTRICAL CHARACTERISTICS (at TA=25℃unless otherwise specified)
Parameters
Symbol
Min.
Typ.
Max.
Unit
Forward Voltage at IF = 0.4A
VF
-
0.9
1
V
TA=25°C
-
0.08
5
Repetitive peak reverse
current@ VR = Max. VRRM
TA=125°C
IRRM
-
-
100
uA
Current squared time t < 8.3ms
I
2t
-
3.74
-
A
2s
Thermal Resistance Junction to Ambient
1
RθJA
-
130
-
Thermal Resistance Junction to Lead
1
RθJL
-
40
-
℃/W
Note:
1.
On glass epoxy P.C.B. mounted on 0.05" x 0.05" (1.3 x 1.3 mm) solder pads.
2.
On aluminum substrate P.C.B. with an area of 0.8 x 0.8" (20 x 20 mm) mounted on 0.05" x 0.05" (1.3 x 13. mm) solder pads.
3.
Preliminary specification.
MBCN
Millimeter
Millimeter
REF.
Min.
Max.
REF.
Min.
Max.
A
3.40
3.60
D
2.00
2.35
B
3.70
3.90
E
0.60
0.80
C
2.44
2.64
F
0.95
1.35
M


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