MPXM2202GS datasheet(150/670 Pages) MOTOROLA

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Motorola Sensor Device Data

www.motorola.com/semiconductors

Device Numbering System for Pressure Sensors

M PX A 2 XXX A P X T1

CATEGORY

Qualified standard

Custom device

Prototype device

P,X

PRESSURE SENSORS

PACKAGE TYPE

Unibody

Small outline package (SOP)

Small outline media

resistant package

Chip pak

Super small outline

package (SSOP)

M–Pak

Super small outline

package (TPMP)

None

A/V

FEATURES*

Uncompensated

Temperature compensated/

calibrated

Open

Temperature compensated/

calibrated/signal conditioned

Automotive accuracy

Temperature compensated/

calibrated/signal conditioned

High temperature

Open

CMOS

None

SHIPPING METHOD

Trays

Tape and reel

1 indicates

part orientation

in tape

Rail

None

No leadform

Open

(Consult factory)

Open

SOP only

NONE

1 thru 2

3 thru 5

6 thru 7

LEADFORM OPTIONS

TYPE OF DEVICE

Absolute

Gauge

Differential

Vacuum/Gauge

PORTING STYLE

Axial port (small outline package)

Ported

Single port (AP, GP, GVP)

Dual port (DP)

Stovepipe port (unibody)

Axial port (unibody)

Rated pressure in kPa,

except for MPX2300,

expressed in mmHg.

(6 = Gull wing/Surface mount)

(7 = 87 degrees/DIP)

Note: Actual product marking may be abbreviated due to space constraints but packaging label will reflect full part number.

*Only applies to qualified and prototype devices. This does not apply to custom devices.

Examples:

MPX10DP

10 kPa uncompensated, differential device in minibody package, ported, no leadform, shipped in trays.

MPXA4115A6T1

115 kPa automotive temperature compensated and calibrated device with signal conditioning, SOP surface mount with

gull wing leadform, shipped in tape and reel.

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

MPXM2202GS 数据表(PDF) 150 Page - Motorola, Inc

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