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ASB Inc.

 sales@asb.co.kr  Tel: +82-42-528-7225

July 2017

ASL551

Wideband Linear Push-pull Amplifier MMIC

Pin No.

Function

Pin No.

Function.

1

RF IN 1

5

RF OUT 2

2

NC

6

NC

3

NC

7

NC

4

RF IN 2

8

RF OUT 1

Mounting Recommendation (In mm)

Outline Drawing

Note: 1. Backside metal paddle is RF and DC ground.

Symbols

Dimensions (In mm)

MIN

NOM

MAX

A

1.40

1.50

1.60

A1

0.00

---

0.10

A2

---

1.45

---

B

0.33

---

0.51

C

0.19

---

0.25

D

4.80

---

5.00

D2

3.20

3.30

3.40

E

5.80

6.00

6.20

E1

3.80

3.90

4.00

E2

2.30

2.40

2.50

e

---

1.27

---

L

0.40

---

1.27

y

---

---

0.10



0



---

8



|L1-L1

’|

---

---

0.12

L1

1.04REF

●

Part No.

ESD Classification

HBM

Class 1B

Voltage Level: 550 V

MM

Class A

Voltage Level: 50 V

CAUTION: ESD-sensitive device!

Moisture Sensitivity Level (MSL)

Level 3 at 260

C reflow

Note: 1. Add as much copper as possible to inner and outer layers

near the part to ensure optimal thermal performance.

2. To ensure reliable operation, device ground paddle-to-ground

pad soldering is critical. Recommended is that thermal

grease should be used for better thermal performance.

3. Add mounting screws near the part to fasten the board to a

heat sinker. Ensure that the ground / thermal via region con-

tacts the heat sinker.

4. A proper heat dissipation path underneath the area of the

PCB for the mounted device is strictly required for proper

thermal operation. Damage to the device can result from in-

appropriate heat dissipation.