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MOUNTING INSTRUCTION

The Rth-j-amb of the L4962 can be reduced by

soldering the GND pins to a suitable copper area of

the printed circuit board (Fig. 32).

function of the side ”l” of two equal square copper

areas having the thickness of 35

µ (1.4 mils). During

soldering the pins temperature must not exceed

260

°C and the soldering time must not be longer

than 12 seconds.

The external heatsink or printed circuit copper are

must be connected to electrical ground.

Figure 32. Example of P.C. board copper area which is used

as heatsink

Figure 33. Maximum dissipable

power and junction to ambient

thermal resistance vs. side ”l”

L4962