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AC16FSM 数据表(PDF) 13 Page - Teccor Electronics |
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AC16FSM 数据表(HTML) 13 Page - Teccor Electronics |
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13 / 223 page  ©2002 Teccor Electronics P - 9 http://www.teccor.com Thyristor Product Catalog +1 972-580-7777 Quality and Reliability Reliability Stress Tests The following table contains brief descriptions of the reliability tests commonly used in evaluating Teccor product reliability on a peri- odic basis. These tests are applied across product lines depending on product availability and test equipment capacities. Other tests may be performed when appropriate. Flammability Test For the UL 94V0 flammability test, all expoxies used in Teccor encapsulated devices are recognized by Underwriters Laboratories Test Type Typical Conditions Test Description Standards High Temperature AC Blocking TA = 100 °C to 150 °C, Bias @ 100% Rated VDRM, t = 24 hrs to 1000 hrs Evaluation of the reliability of product under bias conditions and elevated temperature MIL-STD-750, M-1040 High Temperature Storage Life TA = 150 °C, t = 250 to 1000 hrs Evaluation of the effects on devices after long periods of storage at high temperature MIL-STD-750, M-1031 Temperature and Humidity Bias Life TA = 85 °C to 95 °C, rh = 85% to 95% Bias @ 80% Rated VDRM (320 VDC max) t = 168 to 1008 hrs Evaluation of the reliability of non- hermetic packaged devices in humid environments EIA / JEDEC, JESD22-A101 Temperature Cycle [Air to Air] TA = -65°C to 150°C, cycles = 10 to 500 Evaluation of the device’s ability to withstand the exposure to extreme temperatures and the forces of TCE during transitions between temperatures MIL-STD-750, M-1051, EIA / JEDEC, JESD22-A104 Thermal Shock [Liquid to Liquid] TA = 0 °C to 100 °C, ttxfr = ≤10 s, cycled = 10 to 20 Evaluation of the device’s ability to withstand the sudden changes in temperature and exposure to extreme temperatures MIL-STD-750, M-1056 Autoclave TA = 121 °C, rh = 100%, P = 15 psig, t = 24 hrs to 168 hrs Accelerated environmental test to evaluate the moisture resistance of plastic packages EIA / JEDEC, JESD22-A102 Resistance to Solder Heat TA = 260 °C, t = 10 s Evaluation of the device’s ability to withstand the temperatures as seen in wave soldering operations MIL-STD-750, M-2031 Solderability Steam aging = 1 hr to 8 hrs, Tsolder = 245 °C, Flux = R Evaluation of the solderability of device terminals after an extended period MIL-STD-750, M-2026, ANSI-J-STD-002 |
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