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ADT7301ARMZ 数据表(PDF) 15 Page - Analog Devices |
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ADT7301ARMZ 数据表(HTML) 15 Page - Analog Devices |
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15 / 17 page ![]() ADT7301 Rev. B | Page 14 of 16 ADT7301-to-ADSP-21xx Interface Figure 18 shows an interface between the ADT7301 and the ADSP-21xx DSP processor. To ensure correct operation of the interface, the SPORT control register should be set up as follows: TFSW = RFSW = 1, alternate framing INVRFS = INVTFS = 1, active low framing signal DTYPE = 00, right justify data SLEN = 1111, 16-bit data-words ISCLK = 1, internal serial clock TFSR = RFS = 1, frame every word IRFS = 0, RFS configured as input ITFS = 1, TFS configured as output The interface requires an inverter between the SCLK line of the ADSP-21xx and the SCLK input of the ADT7301. On the ADSP-21xx interface, the TFS and RFS of the SPORT are tied together; TFS is set as an output, and RFS is set as an input. The DSP operates in alternate framing mode and the SPORT control register is set up as described in this section. ADT7301* SCLK DOUT DIN ADSP-21xx* SCK DR DT RFS *ADDITIONAL PINS OMITTED FOR CLARITY TFS CS Figure 18. ADT7301-to-ADSP-21xx Interface MOUNTING THE ADT7301 The ADT7301 can be used for surface or air temperature sensing applications. If the device is cemented to a surface with a thermally conductive adhesive, the die temperature will be within about 0.1°C of the surface temperature because of the ADT7301’s low power consumption. Care should be taken to insulate the back and leads of the device if the ambient air temperature is different from the surface temperature being measured. The ground pin provides the best thermal path to the die; therefore, the temperature of the die is close to that of the printed circuit ground track. Care should be taken to ensure that this is in good thermal contact with the measured surface. As in any IC, the ADT7301 and its associated wiring and circuits must be kept free from moisture to prevent leakage and corrosion, particularly in cold conditions where condensation is more likely to occur. Water-resistant varnishes and conformal coatings can be used for protection. The small size of the ADT7301 allows it to be mounted inside sealed metal probes, which provide a safe environment for the device. SUPPLY DECOUPLING The ADT7301 should be decoupled with a 0.1 µF ceramic capacitor between VDD and GND. This is particularly important if the ADT7301 mount is remote from the power supply. |
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