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REVISION HISTORY

Table 25. Document Revision History

Date

Version

Description of Revision

10-Dec-1999

2.4

TSSOP8 Turned-Die package removed (p 2 and order information)

Lead temperature added for TSSOP8 in table 2

18-Apr-2000

2.5

Labelling change to Fig-2D, correction of values for ‘E’ and main caption for Tab-13

05-May-2000

2.6

Extra labelling to Fig-2D

23-Nov-2000

3.0

SBGA package information removed to an annex document

-R range changed to being the -S range, and the new -R range added

19-Feb-2001

3.1

SBGA package information put back in this document

Lead Soldering Temperature in the Absolute Maximum Ratings table amended

Write Cycle Polling Flow Chart using ACK illustration updated

References to PSDIP changed to PDIP and Package Mechanical data updated

Wording brought in to line with standard glossary

20-Apr-2001

3.2

Revision of DC and AC characteristics for the -S series

08-Oct-2001

3.3

Ball numbers added to the SBGA connections and package mechanical illustrations

09-Nov-2001

3.4

Specification of Test Condition for Leakage Currents in the DC Characteristics table

improved

30-Jul-2002

3.5

Document reformatted using new template. SBGA5 package removed

TSSOP8 (3x3mm² body size) package (MSOP8) added. -L voltage range added

04-Feb-2003

3.6

Document title spelt out more fully. “W”-marked devices with tw=5ms added.

05-May-2003

3.7

-R voltage range upgraded to 400kHz working, and no longer preliminary data.

5V voltage range at temperature range 3 (-xx3) no longer preliminary data.

-S voltage range removed. -Wxx3 voltage+temp ranged added as preliminary data.

07-Oct-2003

4.0

Table of contents, and Pb-free options added. Minor wording changes in Summary

17-Mar-2004

5.0

Soldering temperature information clarified for RoHS compliant devices. Device grade

information clarified. Process identification letter “G” information added. 2.2-5.5V range is

removed, and 4.5-5.5V range is now Not for New Design