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LC450029PKB 数据表(PDF) 23 Page - ON Semiconductor |
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LC450029PKB 数据表(HTML) 23 Page - ON Semiconductor |
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23 / 25 page ![]() LC450029PKB www.onsemi.com 23 PAD Locations (Bump Side View) Chip dimensions (X, Y, S are based on the dicing center.) X=1.00mm Y=4.08mm S=4.08mm 2 Wafer thickness=400 m (typ) Au Bump dimensions (typ) Item PAD No. Size X [ m] Y [ m] S [ m2] Bump Size 1 to 59 108 27 2916 60 to 106 68 42 2856 Min. Bump Pitch 10 to 58 50 - 1 to 9, 59 to 106 - - Min. Bump Clearance 10 to 58, 66 to 71, 73 to 90, 93 to 105 23 - 1 to 9, 59 to 65, 72, 91 to 92, 106 - - Bump Height All pads 17 - Alignment marks (1) A-Type (2) B-Type (3) C-Type X Y (0, 0) Alignment Mark #1 (A-Type) Alignment Mark #2 (B-Type) Alignment Mark #3 (C-Type) MODEL NAME 10 30 60 50 80 50 80 20 Unit: m |
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