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M24C08-RMB3TG/W 数据表(PDF) 13 Page - STMicroelectronics |
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M24C08-RMB3TG/W 数据表(HTML) 13 Page - STMicroelectronics |
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13 / 29 page ![]() 13/29 M24C16, M24C08, M24C04, M24C02, M24C01 MAXIMUM RATING Stressing the device above the rating listed in the Absolute Maximum Ratings" table may cause per- manent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not im- plied. Exposure to Absolute Maximum Rating con- ditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality docu- ments. Table 4. Absolute Maximum Ratings Note: 1. Compliant with JEDEC Std J-STD-020B (for small body, Sn-Pb or Pb assembly), the ST ECOPACK® 7191395 specification, and the European directive on Restrictions on Hazardous Substances (RoHS) 2002/95/EU 2. JEDEC Std JESD22-A114A (C1=100 pF, R1=1500 Ω, R2=500 Ω) Symbol Parameter Min. Max. Unit TSTG Storage Temperature –65 150 °C TLEAD Lead Temperature during Soldering See note 1 °C VIO Input or Output range –0.50 6.5 V VCC Supply Voltage –0.50 6.5 V VESD Electrostatic Discharge Voltage (Human Body model) 2 –4000 4000 V |
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