Features

Batch process design,excellent power dissipationoffers

better reverse leakagecurrent and thermalresistance.

Low profile surfacemounted application inorder to

optimize board space.

High current capability.

High surge currentcapability.

Glass passivated chipjunction.

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Mechanical data

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Epoxy:UL94-V0 rated flameretardant

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Case : Moldedplastic, JEDEC SMA-LS

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Terminals : Solder plated,solderable per

MIL-STD-750, Method 2026

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Polarity : Indicatedby cathode band

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Mounting Position :Any

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Weight : Approximated 0.05gram

0.193(4.9)

0.177(4.5)

0.012(0.3) Typ.

0.106(2.7)

0.091(2.3)

0.071(1.8)

0.055(1.4)

0.040 (1.0) Typ.

0.040(1.0) Typ.

Dimensions in inches and (millimeters)

SMA-LS

PFFM201LS

PFFM202LS

PFFM203LS

50

100

200

35

70

140

SYMBOLS

V

RRM

(V)

V

RMS

V

R

(V)

(V)

*1

*2

*3

*1 Repetitive peakreverse voltage

*2 RMS voltage

*3 Continuous reversevoltage

*4 Maximum forwardvoltage@IF=2A

*5 Reverse recoverytime

V

F

(V)

*4

PFFM204LS

PFFM205LS

400

600

280

420

1.30

-55 to +150

PFFM206LS

PFFM207LS

800

1000

560

700

o

A

PARAMETER

CONDITIONS

Forward rectified current

Forward surge current

Reverse current

Thermal resistance

Diode junction capacitance

Storage temperature

See Fig.1

8.3ms single halfsine-wave superimposed on

rate load (JEDECmethode)

f=1MHz and applied4V DC reversevoltage

Symbol

MIN.

TYP.

MAX. UNIT

I

O

I

FSM

I

R

R

è

JA

C

J

T

STG

A

A

uA

O

C/W

O

C

pF

2.0

50

5.0

+175

-65

35

O

V = V

T = 25 C

R

RRM

A

O

V = V

T = 125 C

R

RRM

A

Junction to ambient

40

100

T

RR

(nS)

*5

150

250

500

50

100

200

400

600

800

1000

O

(C)

Operating

temperature

T,

J

Halogen free product for packing code suffix "H"

RoHS product for packing code suffix "G"

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PFFM201LS THRU PFFM207LS

1

www.paceleader.tw

2.0A SUFRACE MOUNT FAST RECOVERY RECTIFIERS-50-1000V

Moisture Sensitivity Level 1