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MP3276AP 数据表(PDF) 5 Page - Exar Corporation

部件名 MP3276AP
功能描述  Fault Protected 16 Channel, 12-Bit Data Acquisition Subsystem
PDF  16 Pages
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制造商  EXAR [Exar Corporation]
网页  http://www.exar.com
标志 EXAR - Exar Corporation

MP3276AP 数据表(HTML) 5 Page - Exar Corporation

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MP3276
5
Rev. 4.00
ELECTRICAL CHARACTERISTICS TABLE (CONT’D)
Description
Symbol
Min
Typ
Max
Min
Max
Units
Conditions
DIGITAL OUTPUTS
COUT=15 pF
(Data Format 2’s Complement)
DB0/SDC–DB11/SDO, STL, STS
Logical “1” Voltage
VOH
4.0
2.4
V
ISOURCE = 0.5 mA
Logical “0” Voltage
VOL
0.4
0.4
V
ISINK = 1.6 mA
Tristate Leakage
IOZ
–5
5
–5
5
µAVOUT=GND to VDD
POWER SUPPLIES
Operating Range
VDD
+4.5
+5.5
+4.5
+5.5
V
VCC
+11.4
+16.5
+11.4
+16.5
V
VEE
–4.75
–16.5
–4.75
–16.5
V
Tested at –11.4 and –16.5 only
Operating Current
IDD
27
7
mA
ICC
58
8
mA
IEE
1.5
3
3
mA
Power Dissipation
110
200
200
mW
25
°C
Tmin to Tmax
NOTES
1
Tester measures code transitions by dithering the voltage of the analog input (VIN). The difference between the measured and the
ideal code width is the DNL error. The INL error is the maximum distance (in LSBs) from the best fit line to any transition voltage
2
Guaranteed. Not tested.
3
All channel input pins and ground reference pin have protection which becomes active above
60 V.
4
All digital inputs have diodes to VDD and AGND. Input DC currents will not exceed specified limits for any input voltage between GND
and VDD.
5
Refin should not vary from Refout by more than
10% of the nominal value of Refout.
Specifications are subject to change without notice
ABSOLUTE MAXIMUM RATINGS (TA = +25
°C unless otherwise noted)1, 2
VCC to DGND
0 to +16.5 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . .
VEE to DGND
0 to –16.5 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . .
VDD to DGND
0 to +7 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AGND to DGND
±1 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Digital Inputs/Outputs
to DGND
–0.5 V to VLOGIC +0.5 V
. . . . . . . . . . . . . . . . . . . . .
Analog Inputs (AIN0 – AIN31, GND REF)
to AGND
±60 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
REF OUT
Indefinite short to DGND,
. . . . . . . . . . . . . . . . . . .
Momentary short to VCC
Maximum Junction Temperature
150
°C
. . . . . . . . . . . . . . . . .
Package Power Dissipation Rating to 75
°C
PGA, PLCC
1800 mW
. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Derates above 75
°C
25 mW/
°C
. . . . . . . . . . . . . . . . . . . . .
Lead Temperature, Soldering
300
°C, 10 Sec
. . . . . . . . . . . .
Storage Temperature (Ceramic)
–65
°C to +150°C
. . . . . . . .
NOTES:
1
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a
stress rating only and functional operation at or above this specification is not implied. Exposure to maximum rating
conditions for extended periods may affect device reliability.
2
Any input pin which can see a value outside the absolute maximum ratings should be protected by Schottky diode clamps
(HP5082-2835) from input pin to the supplies.
All logic inputs have protection diodes which will protect the device from
short transients outside the supplies of less than 100mA for less than 100
µs.



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