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MP3276AP 数据表(PDF) 5 Page - Exar Corporation |
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MP3276AP 数据表(HTML) 5 Page - Exar Corporation |
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5 / 16 page ![]() MP3276 5 Rev. 4.00 ELECTRICAL CHARACTERISTICS TABLE (CONT’D) Description Symbol Min Typ Max Min Max Units Conditions DIGITAL OUTPUTS COUT=15 pF (Data Format 2’s Complement) DB0/SDC–DB11/SDO, STL, STS Logical “1” Voltage VOH 4.0 2.4 V ISOURCE = 0.5 mA Logical “0” Voltage VOL 0.4 0.4 V ISINK = 1.6 mA Tristate Leakage IOZ –5 5 –5 5 µAVOUT=GND to VDD POWER SUPPLIES Operating Range VDD +4.5 +5.5 +4.5 +5.5 V VCC +11.4 +16.5 +11.4 +16.5 V VEE –4.75 –16.5 –4.75 –16.5 V Tested at –11.4 and –16.5 only Operating Current IDD 27 7 mA ICC 58 8 mA IEE 1.5 3 3 mA Power Dissipation 110 200 200 mW 25 °C Tmin to Tmax NOTES 1 Tester measures code transitions by dithering the voltage of the analog input (VIN). The difference between the measured and the ideal code width is the DNL error. The INL error is the maximum distance (in LSBs) from the best fit line to any transition voltage 2 Guaranteed. Not tested. 3 All channel input pins and ground reference pin have protection which becomes active above 60 V. 4 All digital inputs have diodes to VDD and AGND. Input DC currents will not exceed specified limits for any input voltage between GND and VDD. 5 Refin should not vary from Refout by more than 10% of the nominal value of Refout. Specifications are subject to change without notice ABSOLUTE MAXIMUM RATINGS (TA = +25 °C unless otherwise noted)1, 2 VCC to DGND 0 to +16.5 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . VEE to DGND 0 to –16.5 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDD to DGND 0 to +7 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AGND to DGND ±1 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Digital Inputs/Outputs to DGND –0.5 V to VLOGIC +0.5 V . . . . . . . . . . . . . . . . . . . . . Analog Inputs (AIN0 – AIN31, GND REF) to AGND ±60 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . REF OUT Indefinite short to DGND, . . . . . . . . . . . . . . . . . . . Momentary short to VCC Maximum Junction Temperature 150 °C . . . . . . . . . . . . . . . . . Package Power Dissipation Rating to 75 °C PGA, PLCC 1800 mW . . . . . . . . . . . . . . . . . . . . . . . . . . . . Derates above 75 °C 25 mW/ °C . . . . . . . . . . . . . . . . . . . . . Lead Temperature, Soldering 300 °C, 10 Sec . . . . . . . . . . . . Storage Temperature (Ceramic) –65 °C to +150°C . . . . . . . . NOTES: 1 Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation at or above this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. 2 Any input pin which can see a value outside the absolute maximum ratings should be protected by Schottky diode clamps (HP5082-2835) from input pin to the supplies. All logic inputs have protection diodes which will protect the device from short transients outside the supplies of less than 100mA for less than 100 µs. |
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