LAP476-R1T1-24-F datasheet(12/21 Pages) OSRAM

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LAP476-R1T1-24-F 数据表(PDF) 12 Page - OSRAM GmbH

12 / 21 page

2015-01-19

Version 1.0

LA P476

Note:

The upper solder pad layout represents the

recommended solder pad for top mounting. For

superior solder joint connectivity results we

recommend soldering under standard nitrogen

atmosphere. Package not suitable for ultra

sonic cleaning.

Anm.:

Das obere Lötpaddesign zeigt das empfohlene

Lötpad für die Montage von oben. Um eine

verbesserte Lötstellenkontaktierung zu

erreichen, empfehlen wir, unter Standard-

Stickstoffatmosphäre zu löten. Das Gehäuse ist

für Ultraschallreinigung nicht geeignet.

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