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LTPWSG 数据表(PDF) 13 Page - OSRAM GmbH |
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LTPWSG 数据表(HTML) 13 Page - OSRAM GmbH |
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13 / 22 page  Version 1.0 LT PWSG 2016-03-18 13 Note: The upper solder pad layout represents the recommended solder pad for top mounting. For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning. Anm.: Das obere Lötpaddesign zeigt das empfohlene Lötpad für die Montage von oben. Um eine verbesserte Lötstellenkontaktierung zu erreichen, empfehlen wir, unter Standard- Stickstoffatmosphäre zu löten. Das Gehäuse ist für Ultraschallreinigung nicht geeignet. |
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