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Proprietary and Confidential

Document of Superworld

14/08/2017

P4

8. Soldering

Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand

soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools.

Note:

If wave soldering is used, there will be some risk.

Re-flow soldering temperatures below 240°C, there will be non-wetting risk

8-1 Solder Re-flow:

Recommended temperature profiles for lead free re-flow soldering in Figure 1.

8-2 Soldering Iron (Figure 2):

Products attachment with soldering iron is discouraged due to the inherent process control limitations. In

the event that a soldering iron must be employed the following precautions are recommended.

Note:

a) Preheat circuit and products to 150°C.

b) 350°C tip temperature (Max.)

c) Never contact the ceramic with the iron tip

d) 1.0mm tip diameter (Max.)

e) Use a 20 watt soldering iron with tip diameter of 1.0mm

f) Limit soldering time to 4~5 secs.

8-3 Soldering Volume:

Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding

solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to

be exceeding as shown in the Figure 3. Minimum fillet height = soldering thickness + 25% product height.