MTLP

www.vishay.com

Vishay Electro-Films

Revision: 16-Nov-17

1

Document Number: 61097

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Wire Bondable Thin Film Micro-Strip Transmission

Line Resistor Arrays

Product may not be to scale

MTLP series of thin film 50

 micro-strip transmission lines

with two rows of tuning pads are designed for test and

measurement applications.

Standard configurations of the MTLP series include an array

of wire bondable terminations that allow integration of

discrete components.

Custom configurations including open, short and load

element are available upon request.

FEATURES

• 50

 micro-strip configuration

• Wire bondable terminations

• Alumina (99.6 %) substrate; as-fired or polished

APPLICATIONS

• Test and measurement setups

• Network analyzer calibration elements

• RF bread boarding

• High frequency hybrid assemblies

CUSTOM DESIGNED ELEMENTS

Vishay EFI will custom design additional geometries and

form factors upon request.

Information about standard design rules can be found at

www.vishay.com/doc?49109

STANDARD ELECTRICAL SPECIFICATIONS

PARAMETER

VALUE

UNIT

Characteristic Impedance

50



Mechanical Tolerances

± 0.1 (± 4 μm)

mil

Operating Temperature Range

-55 to +125

°C

DIMENSIONS in inches

LENGTH

WIDTH

THICKNESS

0.01 to 0.5

0.03 ± 0.002

0.010 ± 0.001

Full ground plane

on back side

0.01" (250 μm)

0.03" (750 μm)

0.01"

(250 μm)

0.004"

(100 μm)

0.0012"

(30 μm)

0.005" square

(125 μm square)