MTR

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Vishay Electro-Films

Revision: 18-Apr-13

2

Document Number: 61045

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

DIMENSIONS in inches

SCHEMATIC

MECHANICAL SPECIFICATIONS

PARAMETER

Chip Size

0.030" x 0.030" ± 0.003" (0.762 mm x 0.762 mm ± 0.076 mm)

Chip Thickness

0.010" ± 0.002" (0.254 mm ± 0.05 mm)

Chip Substrate Material

Oxidized silicon, 10 kÅ minimum SiO2

Resistor Material

Tantalum nitride, self-passivating

Bonding Pads

0.004" x 0.004" (0.10 mm x 0.10 mm)

Number of Top Pads

13

Pad Material

10 kÅ minimum aluminum

Backing

None, lapped semiconductor silicon

GLOBAL PART NUMBER INFORMATION

Global Part Number: MTR24001KAKANHWS

Global Part Number Description: MTR 24K 10 %, format A, 100 ppm/°C, Al pads, no back metal, class H, WS

MODEL

RESISTANCE

RESISTANCE

MULTILPLIER

CODE

TOL.

CODE

(%)

FORMAT

TCR

(ppm/°C)

TERMINATION

BACK

METAL

VISUAL

CLASS

PACKAGING

CODE

MTR

First 4 digits

are significant

figures of

resistance

A = 0.1

0 = 1

1 = 10

2 = 100

J = 5.0

K = 10

M = 20

L = 25

A = Form A

B = Form B

K = ± 100

M = ± 250

R = 0/- 250

G = Gold

A = Aluminum

G = Gold

N = None

H = Class H

K = Class K

WS =

Waffle pack

100 min,

1 mult

Historical Part Number: WMTR05024001K (will continue to be accepted)

0.030

0.004

0.004

0.030

Format B

0.030

0.004

0.030

0.004

Format A

R

R

R

R

5

R

13

1

R

R

5

R

5

R

5

R

5

R

5

R

R

001

K

K

A

N

A

2

HW

R

MT

4

S