Document Number: 60073

Revision 01-May-03

www.vishay.com

166

S30R / A30R, S30V / A30V

Vishay Thin Film

VISHAY THIN FILM • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121

• ITALY + 39.2.300.11919 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988

• SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (610) 407-4800 FAX: (610) 640-9081

SUBSTRATE

SILICON

Thickness (Mils)

10

± 2

14

± 2

Isolation Layer

None

SiO

Metallization

Gold (15,000 Å)

Gold (15,000 Å)

Die Size (X)

30 x 30

± 3 MIL

30 x 30

± 3 MIL

Terminations

4 Mils Square Min.

4 Mils Square Min.

Packaging Standard 2" Square Waffle Pack (400 Max. per Package)

DIMENSIONS

1

Alumina has the benefit of the higher thermal conductivity

and superior high frequency characteristics, however the

resistance range is limited by the poorer line resolution

versus silicon, because of the surface finish.

Visual Criteria

MIL-STD-833 Method 2032 Class H

Thermal Shock (MIL-STD-202, Method 107, Test Condition C)

0.05% Max.

∆R/R (0.02% Typical)

High Temperature Exposure (125

°C, 100 Hours in Air)

0.10% Max.

∆R/R (0.07% Typical)

Low Temperature Operation (MIL-PRF-55342 Paragraph 4.7.4)

0.05% Max.

∆R/R (0.025% Typical)

Moisture Resistance (MIL-STD-202 Method 106)

0.25% Max.

∆R/R (0.05% Typical)

Short Time Overload (5 x Rated Power 25

°C, 5 sec.)

0.25% Max.

∆R/R (0.05% Typical)

Resistance Ratio Accuracy

± 2% Standard or ± 0.1 ohm whichever is greater (0.05% available)

Resistive Element

Tamelox®

Termination Pads

Gold

Substrate Material

Silicon or Alumina

T

X

X

Center Tap Chip Resistor

MECHANICAL SPECIFICATIONS

FULL LOT TRACEABILITY TO WAFER LEVEL