| 制造商 | 部件名 | 数据表 | 功能描述 |
 Microchip Technology |
DSA6301ML3JB-T
|
588Kb/26P
|
Ultra-Small, Ultra-Low Power MEMS Oscillatorwith Spread Spectrum for Automotive
08/15/18
|
|
DSA6311ML3JB-T
|
588Kb/26P
|
Ultra-Small, Ultra-Low Power MEMS Oscillatorwith Spread Spectrum for Automotive
08/15/18
|
|
DSA6331ML3JB-T
|
588Kb/26P
|
Ultra-Small, Ultra-Low Power MEMS Oscillatorwith Spread Spectrum for Automotive
08/15/18
|
|
DSA6341ML3JB-T
|
588Kb/26P
|
Ultra-Small, Ultra-Low Power MEMS Oscillatorwith Spread Spectrum for Automotive
08/15/18
|
|
DSA6351ML3JB-T
|
588Kb/26P
|
Ultra-Small, Ultra-Low Power MEMS Oscillatorwith Spread Spectrum for Automotive
08/15/18
|
|
DSA6371ML3JB-T
|
588Kb/26P
|
Ultra-Small, Ultra-Low Power MEMS Oscillatorwith Spread Spectrum for Automotive
08/15/18
|
| Search Partnumber :
Start with "1ML3JB-T" -
Total : 100 ( 1/5 Page) |
 RMT Ltd. |
1ML06-017
|
838Kb/4P |
Thermoelectric Module
|
|
1ML06-017-05
|
392Kb/4P |
Thermoelectric Module
|
|
1ML06-017-05
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1ML06-017-05
|
2Mb/8P |
Blank ceramics (not metallized)
|
|
1ML06-017-05AN
|
386Kb/4P |
Thermoelectric Module
|
|
1ML06-017-05AN05
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1ML06-017-05AN25
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1ML06-017-05T
|
390Kb/4P |
Thermoelectric Module
|
|
1ML06-017-05T
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1ML06-017-05T
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1ML06-017-05
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1ML06-017-07
|
392Kb/4P |
Thermoelectric Module
|
|
1ML06-017-07
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1ML06-017-07
|
2Mb/8P |
Blank ceramics (not metallized)
|